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KINGSTON HyperX Impact 4GB DDR3L 2133Mhz CL11 Notebook Ram (HX321LS11IB2/4) Cheap, Low Price

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2 months ago by flexi-dynamic

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RM197

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DESCRIPTION HyperX HX321LS11IB2/4 is a 512M x 64-bit (4GB) DDR3L-2133 CL11 SDRAM (Synchronous DRAM) 1Rx8, low voltage, memory modules, based on eight 512M x 8-bit DDR3 FBGA components. This module has been tested to run at DDR3L-2133 at a low latency timing of 11-12-13 at 1.35V or 1.5V. Additional timing parameters are shown in the PnP Timing Parameters section below. The JEDEC standard electrical and mechanical specifications are as follows: Document No. 4807284-001.A00 03/17/15 Page 1 SPECIFICATIONS CL(IDD) 11 cycles Row Cycle Time (tRCmin) 44.22ns (min.) Refresh to Active/Refresh 260ns (min.) Command Time (tRFCmin) Row Active Time (tRASmin) 31.875ns (min.) Maximum Operating Power TBD W* @1.35V UL Rating 94 V - 0 Operating Temperature 0o C to 85o C Storage Temperature -55o C to +100o C *Power will vary depending on the SDRAM used. HX321LS11IB2/4 4GB 512M x 64-Bit DDR3L-2133 CL11 204-Pin SODIMM Continued >> kingston.com/hyperx PnP JEDEC TIMING PARAMETERS: • DDR3-2133 CL11-12-13 @1.35V or 1.5V • DDR3-1866 CL10-11-12 @1.35V or 1.5V • DDR3-1600 CL9-9-10 @1.35V or 1.5V PnP JEDEC TIMING PARAMETERS: • DDR3-2133 CL11-12-13 @1.35V or 1.5V • DDR3-1866 CL10-11-12 @1.35V or 1.5V • DDR3-1600 CL9-9-10 @1.35V or 1.5V SPECIFICATIONS CL(IDD) 11 cycles Row Cycle Time (tRCmin) 44.22ns (min.) Refresh to Active/Refresh 260ns (min.) Command Time (tRFCmin) Row Active Time (tRASmin) 31.875ns (min.) Maximum Operating Power TBD W* @1.35V UL Rating 94 V - 0 Operating Temperature 0o C to 85o C Storage Temperature -55o C to +100o C *Power will vary depending on the SDRAM used. FEATURES • JEDEC standard 1.35V and 1.5V • VDDQ = 1.35V and 1.5V • 1066MHz fCK for 2133Mb/sec/pin • 8 independent internal bank • Programmable CAS Latency: 15, 14, 13, 12, 11, 10, 9, 8, 7, 6 • Programmable Additive Latency: 0, CL - 2, or CL - 1 clock • 8-bit pre-fetch • Burst Length: 8 (Interleave without any limit, sequential with starting address “000” only), 4 with tCCD = 4 which does not allow seamless read or write [either on the fly using A12 or MRS] • Bi-directional Differential Data Strobe • Internal(self) calibration : Internal self calibration through ZQ pin (RZQ : 240 ohm ± 1%) • On Die Termination using ODT pin • Average Refresh Period 7.8us at lower than TCASE 85°C, 3.9us at 85°C < TCASE < 95°C • Asynchronous Reset • PCB : Height 1.180” (30.00mm), double sided component WhatsApp: https://wa.me/60149120576 Contact: 014-9120576 Adrian Aw E-Mail: flexidynamicofficial@gmail.com

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